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PiG Phosphor-in-Glass One-Page Defect Rectification SOP (Workstation Post Version)

PiG Phosphor-in-Glass One-Page Defect Rectification SOP (Workstation Post Version)

2026-06-18
PiG Phosphor-in-Glass One-Page Defect Rectification SOP (Workstation Post Version)

Scope of Application: Compressed bulk PiG, printed PiGF | Control Standard: Furnace temperature difference ≤3℃, Sintering oxygen content ≤10ppm, Powder vacuum drying: 150℃ for 6h

Process Red Line: Nitride/KSF phosphor prohibited from high-temperature air sintering; Direct dry mixing & compression molding is forbidden


I. Visual Defects (On-site Inspection & Immediate Rectification)
Defect Phenomenon Root Cause On-site Quick Solutions (Parameter Adjustment)
Internal bubbles, surface bulges, foggy & low light transmittance Moist powder, entrapped air, no exhaust heat preservation 1. Vacuum dry raw materials for 6h; 2. Vacuum defoam slurry for 30min; 3. Keep 500℃ for 30min under slight negative pressure for air exhaust
Finished crack, edge chipping, easy breakage during cutting Fast heating/cooling rate, uneven green body density, no annealing treatment Heating rate ≤3℃/min, cooling rate ≤5℃/min; Add 450℃ annealing for 60min; Stage compression with 60s pressure holding
Sheet curling, sintering collapse, undersized dimension Excessive sintering temperature, long holding time, no supporting fixture Reduce peak temperature by 10~20℃; Shorten high-temperature holding time; Full coverage support with alumina ceramic plate
Black spots, hard impurities, surface pits Unsieved powder, zirconia tank debris, binder carbonization from incomplete degreasing Sift powder via 800-mesh screen; Replace grinding tank liner regularly; Extend degreasing holding time at 350℃
Overall devitrification, crystal ring, striped haze Glass high-temperature crystallization, phosphor-glass interfacial reaction Reduce furnace temperature by 20℃; Cut high-temperature holding time by half; Adopt coated phosphor preferentially

II. Optical Defects (Integrating Sphere Test & Batch Parameter Adjustment)
Defect Phenomenon Root Cause On-site Quick Solutions (Parameter Adjustment)
Large color difference on single piece/batch, excessive color coordinate drift Powder segregation, uneven furnace temperature, fluctuating oxygen content Wet mixing + powder granulation; Install homogenizing plate inside furnace; Stabilize furnace oxygen content ≤10ppm
Low luminous efficiency, missing red light, blackened phosphor Nitride phosphor oxidation, high-temperature thermal degradation Full-process sealed nitrogen sintering; Adopt low-temperature glass (sintering below 500℃); Eliminate furnace air leakage
Whitening & severe luminous decay after 85℃/85RH aging test High alkali metal content of glass, ion migration Replace low-alkali/alkali-free glass; Apply moisture-proof coating on finished products; Add annealing process
Uneven light spot & partial yellowing under high-power lighting Phosphor agglomeration, poor thermal conductivity, interfacial scattering Filter slurry to remove agglomerates; Add BN/alumina thermal conductive filler; Apply surface coating on phosphor

III. Green Body & Powder Defects (Mixing & Pressing Station)
Defect Phenomenon On-site Quick Solutions
Slurry delamination, up-down color difference, powder sedimentation Add dispersant; Keep low-speed constant stirring before molding; Granulate powder after wet mixing
Powder falling off green body, low strength & easy damage in handling Adjust binder dosage; Extend pressure holding time; Adopt quantitative powder feeding

IV. 5 Daily Inspection Items Per Shift
  1. Powder: Qualified vacuum drying, sieved without agglomeration
  2. Mixing: Wet mixing mandatory, slurry finished vacuum defoaming
  3. Molding: Stable press pressure, compliant stage compression & pressure holding
  4. Sintering: Stable furnace temperature, qualified oxygen content, normal degreasing process
  5. Environment: Sealed & moisture-proof workshop for nitride phosphor production

V. Emergency Process Rules (Direct Parameter Adjustment for Defects)
  • Bubble defect: Add 500℃ exhaust heat preservation, sinter under slight negative pressure
  • Crystallization & color drift: Reduce sintering temperature by 20℃, shorten high-temperature holding time
  • Red phosphor failure: Inspect furnace airtightness, increase nitrogen replacement flow
  • Crack defect: Slow down heating/cooling rate, mandatory low-temperature annealing